F-22G feature:

• lower running cost
• very uniform coating and flat soldering pad
• lower ionic contamination
• no staining on gold finishing
• excellent heat-resistance and solderabilityafter multi-IR reflow
• excellent humidity resistance to prevent copper for approx. 12months
• no staining with higher copper ion
• compatible with lead free SMT process
• compatible with No-cleanSMTprocess
• no VOC risk
• lower operation temperature to protect PWBs construction
• moderate chemical feature , so that no damage Soldermask