Application:

It is suitable for rigid and flexible PWBs，as well as IC packing with leadfree requirements.

Feature:

• lower running cost
• very uniform OSP coating and flat soldering pads
• lower ionic contamination
• excellent heat-resistance and solder ability after multi-IR reflow
• excellent humidity resistance to prevent copper for approx. 12months
• compatible with lead free SMT process
• compatible with No-clean SMTprocess
• no VOC risk
• lower operation temperature to protect PWBs construction
• moderate chemical feature , so that no damage Soldermask