Product features：

PL – 158 is a formic acid type cleaner to remove solder mask residue and poor development residue on copper surface, using special surfactant, good washing and cleaning performance, no impact on the solder mask and dry film, it can powerfully remove oxidation and poor development on the copper surface and it has cleaning and activation on the copper circuit.

Solution characteristic：

SEM photo before acid cleaner treatment

SEM photo after acid cleaner treatment

surface roughness before acid cleaner treatment

surface roughness after acid cleaner treatment