Ⅰ.Introduction

ME-102 is an additive for PCB copper surface micro-erosion, and it mixed proportionally with PPS can form an excellent copper surface micro-etching liquid for printed circuit boards. Its main uses are as follows:

• Process micro-erosion before Organic shielded welding process (OSP).
• Process micro-erosion before solder coating.
• Process micro-erosion before solder masking.
• Pretreatment of dry film lamination (inner board and outer board).
• Pretreatment of coating copper guard agent (copper surface antioxidant).

Ⅱ. Product features

• With good effect of galvani inhibition for chemical board micro-etching.
• With no additional acid, easy to operate.
• The processed copper surface is of even roughness and fine, with strong deoxidation ability.
• Little COD, simple to treat wastewater.
• With no pungent smell, environmental protection and safety.
• Spray and dip type both can be used.

Ⅲ.Product specification

Appearance: colorless or light yellow liquid

Specific gravity: 1.28 ± 0.05

Acidity: 6±1N

Ⅳ.Using method

1. Building bath (v/v %):

• Pure water: 50%
• PPS:20~120g/L (based on customer requirement for micro-etching volume)
• ME-102：8～12%
• Pure water: allowance

2. Addition of ME-102:
Add after analysis on ME-102 concentration of micro-etching liquid.

Ⅴ. Conditions for use

• Operating temperature: 25~45℃ (based on customer requirement for micro-etching volume).
• Time for receiving liquid: dip for less than about 1 minute; spray for about 20-50 seconds (depending on equipment parameters).
• When dipped, the liquid is required for appropriate mixing, and it is used when it is uniform.
• When the majority of boards are centralized for treatment, a certain space between boards is kept to avoid duplicated treatment, leading to over-etching phenomenon.
• Wash with water fully after the micro-etching.