Ⅰ. Product description

BJ-101 is a stabilizer of hydrogen peroxide micro-etching series, and it mixed proportionally with sulfuric acid-hydrogen peroxide can form a copper surface micro-etching liquid for printed circuit boards. Its main uses are as follows:

• Solder coating pretreatment.
• Process micro-erosion before solder masking.
• Pretreatment of dry film lamination (inner board and outer board).
• Pretreatment of coating copper guard agent (copper surface antioxidant).
• Pretreatment of composite board blackening.

Ⅱ.Product features

• With good effect of galvani inhibition for chemical board micro-etching.
• A clean roughened copper surface available.
• Eliminate the vitriolization process.
• Little COD, easy for drainage.
• Little excitant odour.
• Spray and dip type both can be used.

Ⅲ. Product specification

Appearance: light brown liquid
Specific gravity: 0.995 ± 0.02

Ⅳ. Using method (Add in order)

1. Building bath (v/v %) (lower the temperature to room temperature (≦ 28℃) and then add BJ-101 and hydrogen peroxide)

• Pure water: 50%
• CP50% sulfate acid: 2~10%
• BJ-101：8～12%
• 35% hydrogen peroxide: 2-6%
• Pure water: allowance

2. Addition of BJ-101:
Add a proportional mix of hydrogen peroxide, and the ratio is 1/5~1/2 of the additive amount of 35% hydrogen peroxide analysis liquid.

Ⅴ. Conditions for use

• Operating temperature: 20~40℃
• Time for receiving liquid: dip for less than 1 minutes; spray for 20-50 seconds
• When dipped, the liquid is required for appropriate mixing, and it is used when it is uniform.
• When the majority of boards are centralized for treatment, a certain space between boards is kept to avoid duplicated treatment, leading to over-etching phenomenon.
• Wash with water fully after being processed, and dry quickly.