1. Introduction:

A-180 is specially designed for removing epoxy resin during plastic injection while IC Packaging Process. A-180 can remove resin in 60°C~80°C.

2．Product Feature:

A. No need Mechanical Removing Process after used
B. No damage for metal base material
C. Suitable for all kinds of EMC
D. No scent

3．Physics Characteristics:

Appearance: Transparent Liquid

4．Density（25℃）:

1± 0.25（25℃）

5． pH (25±2℃):

pH=3.9±0.3(25±2℃)

6．Usage:

No Minglement, direct Using.

7．Operation:

Consistency: Direct using, no dilute required
Temperature: 60°C ~ 80°C
Time: Depends on different kinds of expoxy material and parts (20 min ~ 60 min)