Product features：

NPD-522 is a surface treatment SMT and W / B for the purpose of reduction of palladium plating chemicals, has superior reliability of lead-free soldering.
Use NPD-522 is recommended with PLATEC the ENIG CN-851 or CN-857 or soft ENIG SN-558.
Can be used to the gold wire bonding, the Reliability compared ENIG good.
Gold cost savings.
nickel deposit rate 0.08 ~ 0.12 μm / 10 min (Adjust the dipping time according to the specification.)
Phosphorus content for palladium : 4~6 ％

Wire bonding

Gold wire : 0.8 mil Ni / Pd / Au 5 / 0.05 / 0.05 μm
Test result : ＞6 g