ME-102 Copper Micro-etching Additive
Ⅰ.Introduction
ME-102 is an additive for PCB copper surface micro-erosion, and it mixed proportionally with PPS can form an excellent copper surface micro-etching liquid for printed circuit boards. Its main uses are as follows:
- Process micro-erosion before Organic shielded welding process (OSP).
- Process micro-erosion before solder coating.
- Process micro-erosion before solder masking.
- Pretreatment of dry film lamination (inner board and outer board).
- Pretreatment of coating copper guard agent (copper surface antioxidant).
Ⅱ. Product features
- With good effect of galvani inhibition for chemical board micro-etching.
- With no additional acid, easy to operate.
- The processed copper surface is of even roughness and fine, with strong deoxidation ability.
- Little COD, simple to treat wastewater.
- With no pungent smell, environmental protection and safety.
- Spray and dip type both can be used.
Ⅲ.Product specification
Appearance: colorless or light yellow liquid
Specific gravity: 1.28 ± 0.05
Acidity: 6±1N
Ⅳ.Using method
1. Building bath (v/v %):
- Pure water: 50%
- PPS:20~120g/L (based on customer requirement for micro-etching volume)
- ME-102:8~12%
- Pure water: allowance
2. Addition of ME-102:
Add after analysis on ME-102 concentration of micro-etching liquid.
Ⅴ. Conditions for use
- Operating temperature: 25~45℃ (based on customer requirement for micro-etching volume).
- Time for receiving liquid: dip for less than about 1 minute; spray for about 20-50 seconds (depending on equipment parameters).
- When dipped, the liquid is required for appropriate mixing, and it is used when it is uniform.
- When the majority of boards are centralized for treatment, a certain space between boards is kept to avoid duplicated treatment, leading to over-etching phenomenon.
- Wash with water fully after the micro-etching.