ME-102 Copper Micro-etching Additive

Ⅰ.Introduction

ME-102 is an additive for PCB copper surface micro-erosion, and it mixed proportionally with PPS can form an excellent copper surface micro-etching liquid for printed circuit boards. Its main uses are as follows:

  • Process micro-erosion before Organic shielded welding process (OSP).
  • Process micro-erosion before solder coating.
  • Process micro-erosion before solder masking.
  • Pretreatment of dry film lamination (inner board and outer board).
  • Pretreatment of coating copper guard agent (copper surface antioxidant).

Ⅱ. Product features

  • With good effect of galvani inhibition for chemical board micro-etching.
  • With no additional acid, easy to operate.
  • The processed copper surface is of even roughness and fine, with strong deoxidation ability.
  • Little COD, simple to treat wastewater.
  • With no pungent smell, environmental protection and safety.
  • Spray and dip type both can be used.

Ⅲ.Product specification

Appearance: colorless or light yellow liquid

Specific gravity: 1.28 ± 0.05

Acidity: 6±1N

Ⅳ.Using method

1. Building bath (v/v %):

  • Pure water: 50%
  • PPS:20~120g/L (based on customer requirement for micro-etching volume)
  • ME-102:8~12%
  • Pure water: allowance

2. Addition of ME-102:
Add after analysis on ME-102 concentration of micro-etching liquid.

Ⅴ. Conditions for use

  • Operating temperature: 25~45℃ (based on customer requirement for micro-etching volume).
  • Time for receiving liquid: dip for less than about 1 minute; spray for about 20-50 seconds (depending on equipment parameters).
  • When dipped, the liquid is required for appropriate mixing, and it is used when it is uniform.
  • When the majority of boards are centralized for treatment, a certain space between boards is kept to avoid duplicated treatment, leading to over-etching phenomenon.
  • Wash with water fully after the micro-etching.